Internationally renowned experts in micro-mechanics and non-destructive testing of composite materials, Professor Jianmin Qu, Dean of Engineering of Tufts University, USA, who is the recipient of the SPIE Nondestructive Testing Final Generation Award and Honorary Professor of Karol Family, accepted the invitation to chair the academic committee of 2018 FENDT New Technology Forum. And he’ll make a keynote report.
Professor Jianmin Qu is a world-renowned expert in micro-mechanics and non-destructive testing of composite materials. He has been at the world's leading level in the fields of interface mechanics and bonding, fatigue and corrosion of metal materials and polymer materials. He also has been at the world's leading level in intelligent structure, structural health monitoring, composite materials, and failure analysis research. Professor Qu has made outstanding achievements in the field of ultrasonic nondestructive testing and microelectronic packaging testing of advanced engineering materials.
Professor Qu received the SPIE Lifetime Achievement Award for Nondestructive Testing in 2017; the IEEE Outstanding Sustained Technical Contribution Award of Electronics, packaging and manufacturing in 2008; Sigma Xi Best Paper Award in 2007; 2007 Sigma Xi Best Master's Thesis Award; ASME fellow, Sigma Xi Young Scholar Award; National Science Foundation Research Innovation Award; Woodruff Faculty fellow of Georgia Tech University; ASME fellow. Member of the National Committee on Theoretical and Applied Mechanics since 2015; from 2013 to 2015, he served as Member and Treasurer, Board of Directors of the American Society of Engineering Sciences. From 2005 to 2012, he served as a member, executive committee member and chairman of the ASME Electronic Packaging Branch. He is a magazine editor at ActaMechanicaSinica，Acta Mechanica，International Journal of Computational Methods，International Journal of Modern Mechanics，Journal of Nondestructive Evaluation，Journal of Surfaces and Interfaces of Materials，ASME Journal of Electronic Packaging，ASME Journal of Pressure Vessel Technology.
Prof. Qu graduated from the Northwestern University in 1987 with a degree in Theory and Applied Mechanics. From 1987 to 1989, he was a postdoctoral researcher in the Department of Mechanical Engineering at the University of Pennsylvania. 1989-1994 he was Assistant Professor of Mechanical Engineering at Georgia Tech University. From 1994 to 2000, he was an associate professor in the Department of Mechanical Engineering at Georgia Tech University. From 2000 to 2009, he was a professor in the Department of Mechanical Engineering at Georgia Tech University, USA. During this period, from 2007 to 2009, he served as the deputy dean of the School of Mechanical Engineering at Georgia Tech University. In 2009-2015, he served as Professor Walter P. Murphy and Head of the Department of Civil and Environmental Engineering at Northwestern University. Since 2015, he has served as Professor Karol Family and Dean of the School of Engineering at the University of Tarfus.
At present, he has published more than 300 papers and 14 academic works in top international journals. In the paper he was cited more than 11,000 times; H-index: 56. Professor Qu has been the project leader for more than a decade, and has undertaken projects from the US Natural Science Foundation, the US Department of Defense, various levels of government and companies, and its funding is nearly $16 million.
His current research areas include: ultrasonic nondestructive testing, electronic packaging testing, composite mechanics, interface mechanics and micromechanics.