Time:2019.06.25~2019.06.27

Address:Qingdao China

2019 Far East NDT New Technology & Application Forum Call for Papers

In order to strengthen the academic exchanges in the field of NDT at home and abroad, fully demonstrate the latest achievements of domestic NDT technology, continuously encourage and promote the independent innovation of NDT technology and products, and guide the professional improvement and growth of NDT technology talents, “FENDT 2019” will be held at Wyndham Grand Qingdao in Qingdao, Shandong province, China, on June 24–27, 2019. In order to publish more and better excellent contributions, we’re collecting contributions from NDT experts, scholars, researchers and technicians at home and abroad.

 

The forum cooperates with IEEE (Institute of Electrical and Electronics Engineers), Insight. Excellent papers will be recommended for related journals (positive journals) or conference proceedings.

 

The scope of papers:

  • Research on basic theory of nondestructive testing
  • Research on non-destructive testing application technology
  • Non-destructive testing practical application case
  • Design and development of non-destructive testing equipment
  • Non-destructive testing automation, intelligent, visualization technology
  • Non-destructive testing regulations and standards
  • Non-destructive testing training, education, qualification and certification
  • Non-destructive testing security and reliability
  • Non-destructive evaluation of material properties and structural health monitoring
  • Other related technologies of non-destructive testing

 

The collected papers will be included in the following venues for exchange:

Venue name

Sponsor

Contact

E-mail

Photoacoustic and ultrasound venue

Nanjing University, Nanjing University of Science & Technology

Liu Xiaozhou

xzliu@nju.edu.cn

Shen Zhonghua

shenzh@njust.edu.cn

Electromagnetic venue

Xiamen University, China University of petroleum, Xi'an Jiaotong University and North Minzu University

Zeng Zhiwei

zeng@xmu.edu.cn

Infrared and terahertz venue

University of Electronic Science and Technology of China, Hunan University

Gao Bing

bin_gao@uestc.edu.cn

He Yunze

yhe@vip.163.com

Artificial intelligence venue

Hunan University and Zhejiang Provincial Special Equipment Inspection and Research Institute

He Yunze

yhe@vip.163.com

Guo Weichan

gwcndt@126.com

Special equipment venue

China Special Equipment Inspection and Research Institute

Zheng Yang

zhengyangchina@126.com

Aerospace and Composites Testing venue

University of Electronic Science and Technology of China, Xiamen University and Nanjing University of Aeronautics and Astronautics

Bai Libing

bailb991@163.com

Rail transit venue

Southwest Jiaotong University, University of Electronic Science and Technology of China, Sichuan University, China Academy of Railway Sciences Co., Ltd. and Nanjing University of Aeronautics and Astronautics

Peng Jianping

peng.jian.ping@126.com

Nuclear power venue

China Nuclear Power Engineering Co., Ltd., CGN Inspection Technology Co., Ltd., Nuclear Power Institute of China and CNNC Research Institute of Nuclear Power Operation

Zhu Congbin

zhucongbin@cgnpc.com.cn

Li Shuliang

13808080443@163.com

Chen Huaidong

chenhuaidong@cgnpc.com.cn

Oil pipe and equipment venue

CNPC Tubular Goods Research Institute

Wang Lianguo

wanglianguo@cnpc.com.cn

Non-destructive testing standards and related technologies venue

Shanghai Research Institute of Materials

Jiang Jiansheng

jjsh9309@163.com

Ship and Ocean Engineering venue

China Classification Society Industrial Corp.

Deng Dan

ddeng@ccsi.com.cn

Steel structure venue

Hua Xin Jian Ce

Zheng Gangbing

1508636505@qq.com

Shandong venue

handong Province Association of Special Equipment, Special Equipment Inspection and Research Institute of Shandong Province and Qingdao Special Equipment Inspection and Research Institute

Guo Huaili

guohuaili@126.com

 

The form of exchange of papers collected:

  • Oral report
  • Poster

The author applies for the form of exchange when submitting the abstract and the person in charge of the venue confirms the form of communication of the report according to the venue and the registration status.

 

Paper submission:

Foreign authors submit papers through the Far East web submission system (please click on “Paper Submission” on the left side of http://2019.fendti.com/En/Default). The paper template can be found in the attachment or paper submission page. The manuscript must be available in both word and PDF versions.

When submitting a paper, you may choose to be recommended to be published in the Chinese Journal of Mechanical Engineering (positive journal, SCI), Insight (positive journal, SCI) or IEEE conference proceedings (EI);

The corresponding paper writing requirements should be consistent with the relevant journal requirements, and the format should be in accordance with the template in the attached document.

 

Forum of anthology:

  • IEEE Conference Proceedings: These papers are required to be written in English. You can find the detailed requirements in attachment 2 or the English website. The papers, passed the full text review, will be published in the IEEE conference album and submitted to EI (indexed and included by EI).
  • Non-IEEE conference papers: These papers are required to be written in Chinese or English.

Academic Award of FENDT:

“FENDT 2019” accepts the collected papers after they have been reviewed and approved, and at the same time our forum set up the following awards:

  • In recognition of the outstanding academic team in the field of non-destructive testing at home and abroad, we set up one “Summit Award for English Paper” (bonus ¥10000), one “Summit Award for Chinese Paper” (bonus ¥5000).
  • Three “FAREAST Excellent English Paper Prize” (non-student) (bonus ¥5000)
  • “SCLEAD Best Student Awards” : Our forum has set a first prize for the English paper (bonus ¥5000); 3 second prizes (bonus ¥2000); 6 third prizes (bonus¥1500).

Important Date:

  • Deadline for abstract submissions (and oral reports): April 10, 2019
  • Deadline for submission of English paper: April 24, 2019
  • Conference registration on June 24, 2019
  • The forum will be held from June 25, 2019 to June 27, 2019

 

 

 

2019 FENDT Preparatory Committee

December 3, 2018

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